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Publication Name / Title: Chip Scale Review |
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Description and details:
The publication is printed eight times a year and covers the chip-scale packaging market with thoroughness unmatched by any other journal. The magazine's mission is to promote the growth of the latest semiconductor packaging technologies that influence design assembly and manufacturing utilizing chip-scale electronics. Chip Scale Review is recognized by its readers as the top publication in its field. Sign up now to take advantage of the free subscription.
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Chip Scale Review |
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